HKUST Beyond Academic Admissions Scholarships, Hong Kong 2022-23

  • Partial Funding
  • Hong Kong University of Science and Technology
  • Undergraduate
  • All Subjects
  • International Students
  • Hong Kong
  • 03/31/2022
Expired in
03/31/2022
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HKUST Beyond Academic Admissions Scholarships.HKUST Beyond Academic Admissions Scholarships.

Description

HKUST Beyond Academic Admissions Scholarships, Hong Kong 2022-23 is open for International Students . The scholarship allows Undergraduate level program(s) in the field of All Subjects taught at Hong Kong University of Science and Technology . The deadline of the scholarship is expired at 31 Mar 2022.

Degree Level

HKUST Beyond Academic Admissions Scholarships, Hong Kong 2022-23 is available to undertake Undergraduate level programs at Hong Kong University of Science and Technology.

Available Subjects

Following subject are available to study under this scholarship program.

  • All Subjects

Benefits

The selected students will be given a one-time award of HKD 50,000 towards their undergraduate study at HKUST.


Eligible Nationalities

All Nationalities

Eligibility Criteria

  • BAAS opens to all prospective HKUST students across the globe (not applicable to Mainland JEE applicants).
  • Applicants have to meet the University’s minimum entrance requirements, the program requirements specified, and English language requirements (if applicable) set by the relevant Schools/IPO.
  • Applicants have to showcase satisfactory performances and positive impacts of the applicants' domain expertise(s) at local, regional, and/or international levels. Each applicant can fill in up to 3 achievement entries for each area of talent. Multi-talents will be considered an edge.
  • Apart from the achievement proof, applicants should submit recommendation letters from their high schools, and clubs/associations/institutes related to applicants' domain expertise.

Application Procedure

 Applicants are required to log in to the online application system of the university and complete their admission applications.

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